Die-Cut Polyimide Film for OLED & LCD Assembly | Precision Masking & Insulation
Die-Cut Polyimide Film for OLED & LCD Assembly | Precision Masking & Insulation
Die-Cut Polyimide Film for OLED & LCD Assembly
Precision-engineered polyimide (Kapton) die-cut parts designed for ultra-thin display panel insulation, COF flex circuit masking, thermal barrier protection, and high-temperature optical component bonding. Manufactured in Class 10,000 / 1,000 cleanroom environments.
File Format: PDF | High Temperature Resistance Test Results
Cleanroom Die-Cutting for Next-Gen Display Panels
As modern OLED, AMOLED, and LCD screens move toward ultra-thin bezel designs and higher component densities, electrical insulation between the display driver IC (DDI), chip-on-film (COF), and metal chassis backplates becomes critical. Standard adhesive films often carry burrs, particle contamination, or dimensional inaccuracies that cause display black spots or short circuits.
Our Die-Cut Polyimide Film Parts are converted in certified cleanrooms using rotary die-cutting and high-speed laser slitting technology. Featuring an ultra-thin polyimide backing combined with high-grade silicone or acrylic adhesives, these custom-shaped insulation gaskets and masking tabs endure thermal press bonding up to 260°C without gas bubble formation, dimensional shrinkage, or adhesive migration.
Technical Data Sheet (TDS)
| Performance Property | Metric Value | Test Method |
|---|---|---|
| Base Material Options | Amber Polyimide (Kapton) / Matte Black Polyimide | Factory Standard |
| Thickness Options | 0.025 mm / 0.05 mm / 0.075 mm / 0.10 mm | ASTM D-3652 |
| Adhesive System | High-Temp Silicone / Thermosetting Acrylic | Factory Standard |
| Cutting Tolerance | ±0.05 mm (High Precision Rotary Die Cut) | Optical Comparator |
| Peak Thermal Resistance | 260°C (500°F) / Continuous 180°C | UL-510 Standard |
| Dielectric Strength | ≥ 5,000 Volts | ASTM D-149 |
| Cleanroom Manufacturing | Class 1,000 / Class 10,000 Certified | ISO 14644-1 |
| Outgassing / Volatiles | Low Volatile Organic Compounds (Low VOC) | ASTM E-595 |
Key Display & Electronics Assembly Applications
COF & FPC Component Insulation
Prevents short circuits between chip-on-film interconnects and the aluminum backplate of OLED/LCD modules.
Display Driver IC Masking
Shields driver IC contacts and gold bond pads during ACF (Anisotropic Conductive Film) thermal compression bonding.
Battery & Flex PCB Isolation
Wraps flexible printed circuits and thin Li-ion battery pouch tabs in compact mobile devices and smartwatches.
Matte Black Light-Blocking Tabs
Custom matte black polyimide die-cut pieces eliminate internal light reflection inside display backlight units (BLU).
Require Custom Engineering Drawings (CAD/DXF) Review or Samples?
Contact our cleanroom converting engineers directly for fast prototype die-cutting, custom release liner designs, and wholesale factory quotations.
Direct WhatsApp Cleanroom Engineering SupportFrequently Asked Questions
Q: How do you prevent dust particle contamination on optical die-cut parts?
A: All our polyimide converting, die-cutting, slitting, and inner packaging processes take place inside ISO Class 1000 cleanroom environments to guarantee dust-free, zero-particle surface quality required for display optical assembly.
Q: Can you supply die-cut parts on continuous rolls with split liners for pick-and-place robotics?
A: Yes! We supply custom die-cut polyimide shapes on continuous PET release liners with optional kiss-cutting, waste-matrix removal, and extended tab liners for rapid automated SMT and robotic assembly lines.
Q: What file formats are accepted for custom die-cut tool fabrication?
A: We accept CAD files in DXF, DWG, STEP, or vector AI formats. Our engineering team can produce precision prototype sample tooling within 24–48 hours for rapid design verification.
Q: Is matte black polyimide film available for anti-reflective light shielding applications?
A: Yes. In addition to standard amber amber Kapton film, we offer high-opacity matte black polyimide film die-cuts that combine high dielectric breakdown strength with total optical opacity to prevent backlight bleed in LCD/OLED modules.
Product features
Product features
Materials and care
Materials and care
Merchandising tips
Merchandising tips
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