260°C High Temp Resistance: Wave Soldering & PCB Masking Tape Performance
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FAQ
Thermal Limits How does Polyimide tape perform under extreme temperatures like 260°C wave soldering, and what is its maximum dwell time?
Our high-temperature Polyimide (PI) tape is specifically formulated with cross-linked silicone pressure-sensitive adhesive for demanding SMT and wave soldering conditions. Under continuous 260°C (500°F) exposure, it maintains structural integrity and adhesive bond for up to 3 to 5 minutes, covering typical wave soldering dwell cycles:
Short-Term Peak: Up to 280°C (536°F) for 30-60 seconds
Continuous Thermal Rating: 260°C (500°F) for 3-5 minutes
Long-Term Operating: 180°C - 200°C for Class H electrical insulation
Residue Performance: Clean 180° peel removal without adhesive ghosts or tin penetration
Need thermal testing curves or TDS documentation for your SMT process? Request Technical TDS on WhatsApp
PCB Masking Does the tape leave glue residue on PCB gold contacts after high-temperature removal?
No. Guaranteed zero residue. Our advanced silicone formulation undergoes high-temperature curing to prevent adhesive transfer onto sensitive PCB gold fingers or copper pads. Even after passing through thermal reflow tunnels, the tape strips away smoothly without requiring secondary solvent cleaning (IPA washes), protecting yield rates in automated assembly lines.
Request free die-cut or roll samples to run on-site wave soldering trials: Request Free Samples for Testing